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PD - 94168A
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-2)
Product Summary
Part Number Radiation Level RDS(on) ID IRHNA597260 100K Rads (Si) 0.102 -35.5A IRHNA593260 300K Rads (Si) 0.102 -35.5A
IRHNA597260 200V, P-CHANNEL
4#
TECHNOLOGY
c
SMD-2
International Rectifier's R5TM technology provides high performance power MOSFETs for space applications. These devices have been characterized for Single Event Effects (SEE) with useful performance up to an LET of 80 (MeV/(mg/cm2)). The combination of low RDS(on) and low gate charge reduces the power losses in switching applications such as DC to DC converters and motor control. These devices retain all of the well established advantages of MOSFETs such as voltage control, fast switching, ease of paralleling and temperature stability of electrical parameters.
Features:
n n n n n n n n n n
Single Event Effect (SEE) Hardened Ultra Low RDS(on) Low Total Gate Charge Proton Tolerant Simple Drive Requirements Ease of Paralleling Hermetically Sealed Surface Mount Ceramic Package Light Weight
Absolute Maximum Ratings
Parameter
ID @ VGS = -12V, TC = 25C ID @ VGS = -12V, TC = 100C IDM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ T STG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Pckg. Mounting Surface Temp. Weight -35.5 -22.5 -142 300 2.4 20 320 -35.5 30 10 -55 to 150 300 ( for 5s ) 3.3 ( Typical )
Pre-Irradiation
Units A
W
W/C
V mJ A mJ V/ns
o
C
g
For footnotes refer to the last page
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1
08/07/01
IRHNA597260
Pre-Irradiation
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
Parameter Drain-to-Source Breakdown Voltage V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient V(BR)DSS RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LS + LD Ciss Coss Crss Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance Input Capacitanc Output Capacitance Reverse Transfer Capacitance Min. Typ. Max. Units -200 -- -- V -- 0.25 -- V/C -- -- 0.11 -- -- 0.102 -- -- 0.2 -2.0 -- -4.0 V 23 -- -- S -- -- -10 A -- -- -25 -- -- -100 nA -- -- 100 -- -- 180 -- -- 60 nC -- -- 40 -- -- 35 -- -- 80 ns -- -- 100 -- -- 200 -- 4.0 -- nH -- -- -- 7170 920 86 -- -- -- pF Conditions VGS = 0V, ID = - 1.0mA Reference to 25C, ID = -1.0mA VGS = -12V, ID = -35.5A VGS = -12V, ID = -22.5A VGS = -12V, ID = -22.5A,TJ =125C VDS = VGS, ID = -1mA VDS > -15V, ID = -22.5 A VDS = -200V, VGS = 0V VDS = -160V, VGS = 0V, TJ = 125C VGS = -20V VGS = 20V ID = -35.5A VDS = -100V VGS = -12V VDD = -100V, ID = -35.5A VGS = -12V, RG = 2.35
Measured from the center of drain pad to center of source pad VGS = 0V, VDS = -25V = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
IS ISM VSD t rr Q RR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Min Typ Max Units
-- -- -- -- -- -- -- -- -- -- -35.5 -142 -5.0 450 5.5
Test Conditions
A
V ns C Tj = 25C, IS = -35.5A, VGS = 0V Tj = 25C, IF =-35.5A, di/dt -100A/s VDD -50V
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
Thermal Resistance
Parameter
RthJC RthJ-PCB Junction-to-Case Junction-to-PC board
Min Typ Max Units
-- -- -- 1.6 0.42 --
C/W
Test Conditions
soldered to a 2" square copper-clad board
Note: Corresponding Spice and Saber models are available on the G&S Website. For footnotes refer to the last page
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Radiation Characteristics Pre-Irradiation
IRHNA597260
International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance program at International Rectifier is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-3 package. Both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison.
Table 1. Electrical Characteristics @ Tj = 25C, Post Total Dose Irradiation
Parameter
BVDSS VGS(th) IGSS IGSS IDSS RDS(on) RDS(on) VSD Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance (TO-3) Static Drain-to-Source On-State Resistance (SMD-2) Diode Forward Voltage 100K Rads(Si)1 Min Max -200 -2.0 -- -- -- -- -- -- -- -4.0 -100 100 -10 0.103 0.102 -5.0 300KRads(Si)2 Min Max -200 -2.0 -- -- -- -- -- -- -- -5.0 -100 100 -10 0.103 0.102 -5.0 Units V nA A V
Test Conditions
VGS = 0V, ID = -1.0mA VGS = VDS, ID = -1.0mA VGS =-20V VGS = 20 V VDS = -160V, VGS =0V VGS = -12V, ID =-22.5A VGS = -12V, ID =-22.5A VGS = 0V, IS = -35.5A
1. Part number IRHNA597260, 2. Part number IRHNA593260
International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.
Table 2. Single Event Effect Safe Operating Area
Ion Br I Au LET (MeV/(mg/cm2)) 37.3 59.9 82.3 Energy (MeV) 285 345 357 VDS (V) Range (m) @VGS=0V @VGS=5V @VGS=10V @VGS=15V @VGS=20V 36.8 - 200 - 200 - 200 - 200 -75 32.7 - 200 - 200 - 200 - 50 -- 28.5 - 200 - 200 - 200 - 35 --
-250 -200 VDS -150 -100 -50 0 0 5 10 VGS 15 20 Br I Au
Fig a. Single Event Effect, Safe Operating Area
For footnotes refer to the last page
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3
IRHNA597260
Pre-Irradiation
1000
100
-5.0V
-I D , Drain-to-Source Current (A)
-I D , Drain-to-Source Current (A)
VGS -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V TOP
1000
VGS -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V TOP
100
-5.0V
10 1 10
20s PULSE WIDTH T = 25 C
J 100
10 1
20s PULSE WIDTH T = 150 C
J 10 100
-VDS , Drain-to-Source Voltage (V)
-VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
1000
2.5
R DS(on) , Drain-to-Source On Resistance (Normalized)
ID = -35.5A
-I D , Drain-to-Source Current (A)
2.0
TJ = 25 C TJ = 150 C
1.5
100
1.0
0.5
10 5.0
15
V DS = -50V 20s PULSE WIDTH 6.5 5.5 6.0 7.0
0.0 -60 -40 -20
VGS = -12V
0 20 40 60 80 100 120 140 160
-VGS , Gate-to-Source Voltage (V)
TJ , Junction Temperature( C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
4
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Pre-Irradiation
IRHNA597260
10000
8000
-VGS , Gate-to-Source Voltage (V)
VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd
20
ID = -35.5A
16
C, Capacitance (pF)
Ciss
VDS =-160V VDS =-100V VDS =-40V
6000
12
4000
8
2000
C rss
0 1
C oss
4
0
FOR TEST CIRCUIT SEE FIGURE 13
150 200 0 50 100 250
10
100
-VDS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
1000
1000 OPERATION IN THIS AREA LIMITED BY R DS(on)
-ISD , Reverse Drain Current (A)
100
TJ = 150 C
10
TJ = 25 C
-I D, Drain-to-Source Current (A)
100
10
1
1ms
Tc = 25C Tj = 150C Single Pulse 1 1 10 100 1000 -VDS , Drain-toSource Voltage (V)
0.1 0.0
V GS = 0 V
1.5 3.0 4.5 6.0
10ms
-VSD ,Source-to-Drain Voltage (V)
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
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5
IRHNA597260
Pre-Irradiation
40
V DS VGS
RD
D.U.T.
+
-ID , Drain Current (A)
VGS
20
Pulse Width 1 s Duty Factor 0.1 %
Fig 10a. Switching Time Test Circuit
10
VDS 90%
0 25 50 75 100 125 150
TC , Case Temperature ( C)
10% VGS
Fig 9. Maximum Drain Current Vs. Case Temperature
td(on)
tr
t d(off)
tf
Fig 10b. Switching Time Waveforms
1
Thermal Response (Z thJC )
D = 0.50 0.1 0.20 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE)
0.01
0.001 0.00001
Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJC + TC 0.1 0.0001 0.001 0.01 1
PDM t1 t2
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
6
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-
30
RG
V DD
Pre-Irradiation
IRHNA597260
EAS , Single Pulse Avalanche Energy (mJ)
VDS
L
600
RG
D .U .T
IA S
+
D R IV E R
VD D V DD A
500
ID -16A -22.5A BOTTOM -35.5A TOP
VGS -20V
tp
0.0 1
400
300
15V
200
Fig 12a. Unclamped Inductive Test Circuit
IAS
100
0 25 50 75 100 125 150
Starting TJ , Junction Temperature( C)
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
tp V(BR)DSS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator Same Type as D.U.T.
QG
50K
-12V 12V
.2F .3F
-12 V
QGS VG QGD
VGS
-3mA
Charge
IG
ID
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
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+
D.U.T.
-
VDS
7
IRHNA597260
Pre-Irradiation
Footnotes:
Repetitive Rating; Pulse width limited by
maximum junction temperature. VDD = -50V, starting TJ = 25C, L=0.5 mH Peak IL = - 35.5A, VGS = -12V ISD - 35.5A, di/dt - 450A/s, VDD - 200V, TJ 150C
Pulse width 300 s; Duty Cycle 2% Total Dose Irradiation with VGS Bias.
-12 volt VGS applied and VDS = 0 during irradiation per MIL-STD-750, method 1019, condition A. Total Dose Irradiation with VDS Bias. -160 volt VDS applied and VGS = 0 during irradiation per MlL-STD-750, method 1019, condition A.
Case Outline and Dimensions -- SMD-2
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 8/01
8
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